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ESD9P5.0ST5G
Transient Voltage
Suppressors
ESD Protection Diodes with Ultra ? Low
Capacitance
The ESD9P Series is designed to protect voltage sensitive components
that require low capacitance from ESD and transient voltage events.
Excellent clamping capability, low capacitance, low leakage, and fast
response time, make these parts ideal for ESD protection on designs that
utilize high ? speed lines such as USB.
Specification Features:
? Low Capacitance 1.3 pF
? Low Clamping Voltage
? Small Body Outline Dimensions:
0.039 ″ x 0.024 ″ (1.00 mm x 0.60 mm)
? Low Body Height: 0.016 ″ (0.4 mm)
? Stand ? off Voltage: 5 V
? Low Leakage
? Response Time is Typically < 1.0 ns
? IEC61000 ? 4 ? 2 Level 4 ESD Protection
? AEC ? Q101 Qualified and PPAP Capable
? This is a Pb ? Free Device
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V ? 0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260 ° C
Device Meets MSL 1 Requirements
http://onsemi.com
SOD ? 923
CASE 514AB
MARKING DIAGRAM
TM
T = Specific Device Code
M = Date Code
ORDERING INFORMATION
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Device
ESD9P5.0ST5G
Package
SOD ? 923
(Pb ? Free)
Shipping ?
8000/Tape & Reel
IEC 61000 ? 4 ? 2 (ESD) Contact
Air
Total Power Dissipation on FR ? 5 Board
(Note 1) @ T A = 25 ° C
Junction and Storage Temperature Range
Lead Solder Temperature ? Maximum
(10 Second Duration)
° P D °
T J , T stg
T L
± 10
± 15
150
? 55 to
+150
260
kV
mW
° C
° C
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics tables starting on
page 2 of this data sheet.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR ? 5 = 1.0 x 0.75 x 0.62 in.
See Application Note AND8308/D for further description of survivability specs.
? Semiconductor Components Industries, LLC, 2013
January, 2013 ? Rev. 1
1
Publication Order Number:
ESD9P5.0S/D
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